(2D/2.5D/3D integration) PoP stack chip cleaning: PoP stack chips are welded at a mm level spacing, and the active agent and other hygroscopic substances left behind by the soldering flux. If there is a small amount of hygroscopic active agent in the smaller layer spacing, it can occupy a relatively large chip space, affecting the reliability of the chip. To remove residues from a limited space, cleaning agents need to have low surface tension to penetrate into the interlayer chips, achieving the goal of removing residues. The cleaning agent developed by Unibright has excellent infiltration ability to ensure the complete removal of residual active agents between chips.

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