IGBT power module cleaning: There are interface bonding issues in the IGBT manufacturing process, such as parallel connection of IGBT chips, connection between chips and DCB substrates, encapsulation of insulating silicone, and overall packaging of power modules. Cleaning the interface before bonding is the most direct and effective method to solve the low reliability of IGBT power modules. Unibright provides water-based cleaning process solutions that remove 100% of interface residues, providing ideal interface bonding conditions for the next process; At the same time, water-based cleaning agents have excellent material compatibility with the chip protective layer and substrate, significantly improving the reliability of the product.



Unibright provides you with professional water-based cleaning solutions for IGBT power modules.