Flip chip cleaning: After reflow soldering the flip chip onto the substrate, the bare chip needs to be filled with filler material. Therefore, any residual solder will cause interface defects such as layering, voids, and stripes in the filling effect. So the residual flux in the narrow space between the chip and substrate is an indispensable process. The cleaning agent developed by Heming Technology has efficient cleaning and penetration capabilities, removing residues and effectively preventing delamination and stripe defects; After cleaning, it can provide appropriate moisture for the bottom filling of the flip chip, effectively preventing the formation of voids.



Unibright provides you with professional water-based cleaning solutions for flip chip processes.